RM 15.00
BGA IC Glue removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones. The ingredients of it is newestly, environmental protection & safest.
It has good permeability; it can quickly soften & loosens solidified resin advesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon. It doesn't not to harm to circuit board and component.