BGA IC Glue Remover
RM 15.00
BGA IC Glue removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones. The ingredients of it is newestly, environmental protection & safest.
It has good permeability; it can quickly soften & loosens solidified resin advesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon. It doesn't not to harm to circuit board and component.
It has good permeability; it can quickly soften & loosens solidified resin advesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon. It doesn't not to harm to circuit board and component.
